搜索结果: 1-2 共查到“电子科学与技术 TAB”相关记录2条 . 查询时间(0.05 秒)
西安电子科技大学微电子封装技术课件 先进封装技术（TAB+3D+WLP）。
Process and Accelerated Aging Test of GANG Bonding for Gold-Plated TAB Outer Leads
GANG Bonding Gold-Plated TAB Outer Leads
<
2011/1/5
This paper presents the evaluation results of thermocompression GANG Bonding of gold-plated TAB outer leads to three kinds of metallized ceramic substrates. Gold-Selective Plating (GSP) substrates for...